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ÜRETİMLERİMİZ

 

 

 

  • Çift Yüzlü Baskı (Double-sided through holes)
  • Dizgi İmkanı
  • Çok Katlı Katı (Multilayer Rigid), Esnek ve Katı (FLEXIBLE AND RIGID-FLEXIBLE PCBs) (3 katmanlı dan 40 katmanlıya kadar (daha fazla katman yapımını da destekliyoruz)
  • Kontrollü empedans (Controlled impedance) ve Z-aksı kontrollü  yönlendirme (Controlled routing on Z-axis) (cavity and press-fit holes)
  • Her türden farklı materyal kullanımı (örneğin; Thermount/Rogers/High Tg FR4/Teflon)
  • HDI teknolojisi (blind and buried vias)
  • SBU teknolojisi (up to 3N3 type)
  • Isı Direnç Teknolojisi (Heat Sink) (internal and external, Cu-lnvor-Cu)
  • Kör / burried Delik açma (Blinded and buried vias)
  • Laser Microvias Teknolojisi
  • Kontrollü empedans Controlled impedance
  • Ultra yüksek frekans dayanımlı kart üretimi (ultra high frequency board)
  • Yüksek Isı dayanımlı kart üretimi (Board with thermal sink)
  • Baskı Doğrulama (Press Fit)
  • Arka Panel (Back pannel - 6mm)
  • Üstün Katman Boşluğu Kapasitesi (Layer Tracks/Space minimum 80 µm)
  • Mekanik Delgi (Mechanical Drill 0.2 mm minimal)
  • Lazer Delgi (Laser Drill minimum 100 µm)

 

 

ÇOK KATLI PCB

 

ÜRETİM TEKNOLOJİLERİMİZ:

  • Through holes
  • Buried vias
  • Sequential blinded vias
  • Controlled impedance

ÜRETİM YETENEĞİMİZ:

  • İç ve Dış Isıs Batırma (Heat Sink)
  • Via Plug
  • Katı ve/veya Esnek Üretimler (40 katlı üretim imkanı)
  • Laminate Kalınlığı:   0,03-5,5 mm
  • Copper Base Kalınlık:  5 - 210 µm (400 µm’e kadar)
  • Surface finishing :
    • Chemical Gold
    • Electrolitic Gold
    • Electrolitic Nickel
    • Electrolitic Tin
    • Elettrolitic Silver
    • Grafite
    • Unviersal Finishes - ENiPIG (Electroless Nickel Palladium Gold)
    • HASL
    • HASL Leadfree (Nihon superior SN 100 Alloy).
  • Homologated solder mask for curtain coater:
    • Taiyo PSR4000 CC100SGHF – Green Gloss)
    • Coates XV501 T4 Imagecure – Green Gloss
  • Homologated solder mask for screen application:
    • Taiyo PSR9000 FXT – Green and amber, all in gloss version)
    • Taiyo PSR4000 GP01EU – Green, red, black, blue and white, all in gloss version (Green also semi-gloss))
    • Coates XV501 ImageSmart – Green Semi Gloss.

KAPASİTEMİZ:

  • Trace minimal width : 85 µm / 215 mils
  • Board Thickness min 0.4 mm to 6 mm maximum

 

KULLANILAN BAZI YÜKSEK ÖZELLİKLİ HAMMADELER:

  • High Tg Multifonctional Epoxy Laminate & Prepreg, low CTE
  • FR4 « Dicy Cured » 150°c - 175°c
  • FR4 148°c « Dicy Cured Halogen free »
  • FR4 HTG 150°c , 180°c - Low CTE
  • BT Resin - Polyimide - Cyanate Ester
  • Hyper Frequency : Glass Teflon, Ceramic Material
  • FR4 standard ITEQ IT140; ISOLA Duraver ML104i - Tg 140 °C;
  • High Tg epoxy (with and withour filler): ITEQ IT180 and IT180A; ISOLA IS420 and PCL370HR;ARLON 45N - Tg 180°C;
  • Epoxy for Lead-free process medium Tg: ITEQ IT158 -Tg 160 °C;
  • High speed digital applications 10 GHz: ISOLA IS620; NELCO N4000-13; ITEQ IT200DK;
  • Resin coated copper foil “RCC B-stage” Polyclad PCL-CF-400
  • BT resin – ISOLA;
  • Gould TCR and Shipley INSITE – Embedded resistor
  • 3M Capacitor Laminates.

 

ÖZEL DESTEKLERİMİZ:

  • Panelisation / Scoring / Soldermask / Dry Film
  • Routing / Axe Z control / Special routing / Plated edge
  • Finishing : SnPb HAL / ENIG / Chemical Tin..

 

FLEX-RIGID PCB 'ler

 

KAPASİTEMİZ :

  • 18 kattan daha fazla kat üretim imkânı (Multilayers more 18 layers)
  • İç içe birden çok esnek kat üretim imkânı (One or several flexible layers inner layer)
  • Özel Yetkinlikler: Buried vias, sequential blinded vias, thermal sink, Press Fit
  • Ham madde olarak FR4 / HTG / Polyimide type Kapton
  • Kontrollü Empedans
  • Farklılaştırma: Souple Circuits
  • Simple - double sides , Multiflex
  • Genel Malzeme: Polyimide type Kapton

 

 

HDI (HIGH DENSITY INTERCONNECTION) PCB 'S

 

  • Sequential Build-Up (“SBU” up to 3N3 constructions) with blind and buried vias, through Inner layers registration by X-ray allignment system or laser drilling vision system.
  • Very fine line (50 µm track) with Controlled Impedance Track, thanks to Direct Imaging for inner/outer layers and Laser automatic optical inspection.
  • Micro laser vias (75 µm diameter) with Laser drilling.
  • Thick copper technology (210 micron – up to 400 micron);
  • Aluminium-backed boards in High Density Power PCB boards;
  • Flex and Rigidflex construction boards.

 

ÖZEL ÜRETİM PCB 'ler (SAVUNMA SANAYİNE ÖZEL)

 

Multilayer all with Rogers 4350 and High TG materials; 16 layer for High speed board application with blind viad filled with prepreg resin: reverse Layup all with inner layer.

 

SAVUNMA SANAYİNE YÖNELİK ÖZEL ÜRETİM ÇÖZÜMLERİMİZ:

  • Polyimide Resin System: Arlon 33N, 35N, 85N; Hitachi MCL-I-671; Arlon EP;
  • Epoxy Resin System: Arlon Kevlar 4NK (Tg 170 °C and 4.7 ppm/°C);
  • Epoxy and Polyimide Thermount®: ARLON 55NT/85RT and Arlon New 85XT “ Thermount replacement material”;
  • Copper/Invar/Copper : tipically 150 µm thick - 17/120/17 µm);
  • Thick copper: up to 500 microns, for BusBar application also.
  • Substrates covering Kapton® for flexible circuits:
    • Flexible Laminates- Kapton®: DuPont PYRALUX LF; PYRALUX FR; PYRALUX AP: Pyralux APR (embedded component)
  • High Frequency materials Teflon® based and non-Teflon based:
    • Rogers: Duroid Copper/Brass supported; RO3003; TMM10;
    • Arlon: AR350; AR600; AR1000; DiClad 527;
    • Rogers: RO4350; RO4003;
    • Arlon: 25N; 25FR;
    • Taconic: RF25A2; TACLAM;
    • Specialty materials for microwave applications: GORE Microlam and Speedboard.